Sputter coating deposition is a method of thin film deposition by sputtering. This involves ejecting material from a "target" (here Aluminum ring), which is a source onto a "substrate" such as a silicon wafer. 

RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.

An evaporator is a device used to turn the liquid form of a chemical substance, such as Chromium and Gold, into its gaseous form - vapor. In this process, the material is evaporated, or vaporized, ending with condensation of atoms and source molecules on all surfaces including the wafers